■  Product Description:  the generic type electronic encapsulating materials widely used in electronic devices.

■  Thermal Conductivity (K value):  0.7~1.0  (W/m ● K)

■  Application:  LED power supply, electronic, electronic circuit.

■  Models:

■  Product features:

●  high performance silicone and  room temperature curing adhesive.

●  two component addition type silicone, no corrosion on the substrate.

●  low viscosity, low shrinkage, convenient operation and application.

●  flame retardant grade: UL94-V0，UL No.: QMFZ2.E465590.

■  Product Pictures: